- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 21/463 - Mechanical treatment, e.g. grinding, ultrasonic treatment
Patent holdings for IPC class H01L 21/463
Total number of patents in this class: 89
10-year publication summary
|
4
|
6
|
4
|
5
|
9
|
9
|
5
|
13
|
15
|
1
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Semiconductor Energy Laboratory Co., Ltd. | 10902 |
6 |
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
6 |
| Disco Corporation | 1745 |
4 |
| BASF SE | 19740 |
3 |
| International Business Machines Corporation | 60644 |
3 |
| Applied Materials, Inc. | 16587 |
3 |
| Infineon Technologies AG | 8189 |
3 |
| Lapis Semiconductor Co., Ltd. | 1004 |
3 |
| Samsung Electronics Co., Ltd. | 131630 |
2 |
| Panasonic Intellectual Property Management Co., Ltd. | 27812 |
2 |
| Ebara Corporation | 1951 |
2 |
| JPMorgan Chase Bank, National Association | 10964 |
2 |
| SunEdison Semiconductor Limited | 47 |
2 |
| Versum Materials US, LLC | 591 |
2 |
| BASF (China) Co., Ltd. | 755 |
2 |
| Kioxia Corporation | 9847 |
2 |
| Siemens AG | 24990 |
1 |
| Panasonic Corporation | 20786 |
1 |
| Intel Corporation | 45621 |
1 |
| Micron Technology, Inc. | 24960 |
1 |
| Other owners | 38 |